Copper Plating Process
Author: Robby
The copper plating process mainly includes the following steps:
Surface treatment: first of all, the metal surface needs to be treated, including degreasing, descaling and polishing processes.
These steps are very important because impurities and oxides on the metal surface will affect the adhesion and uniformity of the copper plating layer.
Therefore, it is necessary to ensure that the metal surface is smooth and clean before proceeding to the next step of the copper plating process.
Cathode Preparation: Before proceeding with the copper plating process, it is necessary to prepare the copper plating tank and copper plating solution. Place the copper plate as the cathode in the copper plating tank, and then connect the cathode with the anode to establish the plating circuit. At the same time, a suitable copper plating bath is prepared to ensure that its chemical composition and concentration meet the requirements.
Copper plating operation: The surface-treated metal products are placed in the copper plating tank as anodes. The copper plating operation is carried out by controlling parameters such as current density, plating time and temperature. During the copper plating process, the copper plating liquid needs to be stirred continuously to keep the concentration of copper ions in the liquid uniform to ensure the uniformity and quality of the copper plating layer.
Cleaning and polishing: After copper plating is completed, the metal products need to be cleaned and polished. Firstly, put the copper-plated products into the cleaning tank to remove the residual copper-plating liquid and impurities. Then polishing treatment is carried out to make the copper-plated surface smoother and brighter.
Surface protection: the last step is to carry out surface protection treatment for copper-plated products, which can be sprayed, electrophoretic coating, etc., to form a protective film and increase the corrosion resistance of the copper-plated layer and the aesthetics.
Advantages and disadvantages of copper plating process:
Advantages: copper plating process can increase the corrosion resistance of the metal, improve electrical conductivity and beautify the surface effect.
Disadvantages: Copper plating process is complex, need to strictly control each link, any one of the links have problems may lead to the quality of copper plating layer is not up to standard.
Through reasonable process and strict operation requirements, we can get high quality copper plating products.