Surface Mount Technology (SMT) refers to a manufacturing process whereby electronic components are placed directly onto the surface of printed circuit boards, rather than passing leads through holes in the board. This technology was pioneered in the 1960s by IBM, who utilized specialized SMT machines to solder components onto boards without wire leads.
Gradually the electronics industry transitioned from through-hole technology (THT) to SMT. Surface-mount devices (SMDs) began replacing traditional through-hole components, as SMT offered significant space savings. By mounting flat onto the surface of the PCB, SMDs reduce wasted board space and enable higher component density. This allows for product miniaturization and improved functionality within the same space.
Connection reliability is also enhanced through SMT. The direct contact between SMD leads and circuit traces produces a stronger, more durable bond compared to through-hole joints where leads bend under the board. Thermal management tends to be better as well.
Today, modern circuit boards utilize a mix of SMT and THT components to optimize performance for different design needs. Most commodity devices are fully SMT, but some components like large transformers remain better suited to traditional assembly due to size and heating. Overall, SMT is the predominant assembly method owing to demonstrated space and reliability advantages over THT. SMT allows for compact designs and manufacturing improvements. It continues revolutionizing electronics production through enabling smaller devices, denser layouts, and streamlined processes. The following outlines the basic flow of an SMT line：
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