SMT007 Magazine

One ubiquitous component in PCB assembly is solder paste. It&#;s what makes assembly happen. We can&#;t attach components without solder, and solder paste is a requirement for surface-mount components.

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It hardly seems like there&#;s much room for innovation in something so common and basic. Yet, much is changing when it comes to applying solder paste: dispensing and jetting evolve right along traditional stencil printing techniques. Each is carving out their own niche of specialization on the manufacturing floor. Of course, the solder paste needs are changing to enable that evolution in print technologies as well.

Come along as we dive into the latest in solder printing in the September issue of SMT007 Magazine.

Features

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• Scrutinizing Solder Printing With Adam Murling and Ron Lasky
• The Pivotal Role of Solder Paste by Mike Konrad
• Mycronic&#;s Jet Set Technology With Wolfgang Heinecke
• Making Waves With Solder Jet Printing by Josh Casper
• Auguring in on Dispensing With Sunny Agarwal
• Solder Printing: A 1:1 Ratio of Technical and Creative by Nolan Johnson

Articles

• PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs by Neil Hubble and Gary Briste
• Some Fundamentals of Tin-bismuth Metallurgy and Electromigration, by PJ Singh, et al.

Columns

• Our Strength Comes From Working Together by Tom Yang

Resources

Dive into our extensive resources on the topic that interests you. It's like a masterclass to be explored at your own pace.

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