Sputtering deposition is one of the most common processes used for thin film deposition: the coating of a surface with a layer of material ranging from fractions of a nanometer to several micrometers in thickness. Thin film deposition is essential to manufacturing of many modern electronic and optical components
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Sputtering deposition uses a plasma, usually formed from a non-reactive gas, to bombard a target---a source of the material to be deposited as a thin film---and knock the atoms of the target material out of its bulk. The ejected atoms then land on the substrate and form a thin film. Since the target does not need to be heated, the technique is very flexible for a wide range of applications. Targets can be composed of pure elements as well as compounds or mixtures.
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Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval-shaped target. Other shapes are available by request.
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For large area thin film deposition, American Elements produces rotatable sputtering targets via casting or plasma deposition onto a tubular substrate. Rotatable sputtering targets are available up to 1,000 mm in length and can be produced from a number of single element, oxide and alloy materials for use in many applications where large film areas are required, such as photovoltaic device fabrication. All machined pieces are produced by casting oversized blanks, and machining down to required specifications. They are usually machined to tolerances of +0.010"/-0" on diameter, length or width, and +/-0.005" on thickness. Larger targets are also finished to a flatness within 0.015". We can accommodate tighter tolerances upon request.
American Elements casts any of the rare earth metals and most other advanced material into rod, bar or plate form, as well as other machined shapes. All as-cast rods, bars and plates are produced from either the pure metal Ingots or sublimed metals. We have a variety of standard sized rod molds, from a minimum of 1/4" diameter up to 3" diameter for most rod needs. Plates are also offered in standard thicknesses, from 1/4" thick to 1" thick. Maximum rod lengths and maximum plate sizes are dependent on melt capacity and furnace room. Small diameter rods may have only a 4"-6" maximum cast length, whereas larger diameter rods may be cast up to about 16" long. Plate sizes can be cast up to a size of 24" x 16". As-cast rods or plates are saw-cut to length or final dimensions, and the metal surface may have visible flow marks.
Diode Sputtering
In diode sputtering, an electric potential difference is applied between the target and the substrate to form a plasma discharge inside a low vacuum chamber. The free electrons in the plasma are immediately removed from the negative potential electrode (cathode). These accelerating electrons collide with neutral gas atoms (Argon) in their path, causing the electrons in the shell of these atoms to separate. As a result, the gas atoms become positive ions and accelerate towards the cathode, causing the sputtering phenomenon. Glow discharge occurs when some of the positive ions return to their ground state by adsorbing free electrons and releasing photons.
This mechanism is called Diode Sputtering and the applied voltage can be DC (with constant poles) or RF (with alternating poles), depending on the target material. One of the problems with this method is that its coating rate is low and it takes longer to do the coating, which causes the target to heat up and damage its atomic structure, which is improved utilizing Magnetron Cathodes.
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