Sputter targets are materials that are used to deposit thin films by the physical vapour deposition (PVD) method of sputtering. Sputtering is a process that involves ejecting atoms from a target surface by bombarding it with energetic ions, usually from an inert gas such as argon. The ejected atoms then condense on a substrate, forming a thin film with the same composition as the target material.
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- Choose a suitable target material and shape. The target material should have high purity, low impurities, uniform microstructure, and good adhesion to the backing plate. The target shape should match the geometry and size of the PVD machine and the substrate. Common target shapes are circular, rectangular, tubular, or planar
- Prepare the target material by melting, casting, forging, rolling, or powder metallurgy techniques. The preparation method should ensure that the target material has high density, low porosity, low stress, and homogeneous composition. The target material may also undergo annealing, machining, polishing, or cleaning processes to improve its surface quality and performance.
- Bond the target material to a backing plate using thermal spraying, diffusion bonding, soldering, brazing, or epoxy techniques. The backing plate is usually made of copper or molybdenum and serves as a mechanical support and a thermal conductor for the target material. The bonding technique should ensure that the target-backing interface has high strength, low resistance, and good thermal contact.
- Test and inspect the sputter target for quality control purposes. The sputter target should meet the specifications for purity, composition, density, thickness, flatness, roughness, grain size distribution, and electrical resistivity. The sputter target should also be free of cracks, voids, inclusions, and other defects that may affect its performance and lifetime
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